Flow and heat transfer analysis of water and ethylene glycol based Cu nanoparticles between two parallel disks with suction/injection effects

Abstract

This article examines the flow and heat transfer of water and ethylene glycol based copper nanoparticles between two parallel squeezing disks with suction/injection effects. Since metallic particles are strongly influence by magnetic field so we have considered MHD effect that is normal to the surface and lower disk is considered to be permeable. Based upon fundamental law of momentum and energy equation, model is constructed in the form of partial differential equations in cylindrical coordinate system. Fully developed mathematical model is carried out in the form of partial differential equation are then transformed into nonlinear ordinary differential equations. These resulting equations depend upon suction/injection parameter A, Hartmann number M, squeezing number S, and nanoparticle volume fraction  are then solved numerically with Runge–Kutta–Fehlberg (RKF) method. Results are examined via velocity and temperature profile for each Cu-Ethylene glycol and Cu-water nanofluid. To analyze the flow and heat transfer behavior at the surface, results are plotted for skin friction and local Nusselt number. It is finally concluded that skin friction coefficient attained from Cu-water remain higher than Cu-ethylene glycol, however this observation is quite opposite for local Nusselt number